Memory-vendor capex composition is not disclosed by purpose — but it IS disclosed by asset class, and that proxy just moved
The question
Verbatim from the backlog row: "Add vendor-side capex composition tracking (greenfield-wafer vs node-migration vs HBM-packaging split) to the hyperscaler-capex EDGAR anchor — dollar level alone misses the disciplined-cycle signal."
This row is the direct execution of open follow-up #2 from [[2026-06-28-chip-memory-cycle-phase2-phase3-indicators]]. The researchable question underneath: can Micron / SK Hynix / Samsung capex composition actually be sourced from public disclosure, at what granularity and lag, and what does the most recent available split say about supply discipline? Phase numbering below is the capital-cycle ladder (P1 tight-supply → P2 capacity-announce → P3 capacity-online/glut → P4 capex-cuts), not the thesis's own Phase 1/2 model — the two are distinct, per the warning in [[2026-08-01-hyperscaler-capex-merchant-vs-inhouse-silicon-decomposition]].
What we already know (from the vault)
- The claim this brief must not re-derive. [[2026-06-28-chip-memory-cycle-phase2-phase3-indicators]] already established that 2026 DRAM capex (~$61.3B, +14% YoY) would have "minimal impact on bit supply growth in 2026" because spend goes to node migration (1-gamma/1c) and TSV/HBM packaging, not greenfield wafers — per-vendor Micron $13.5B, SK Hynix $20.5B, Samsung $20B (TrendForce, Nov 2025). The doctrine "watch composition, not level" is settled vault policy. What was never established is whether that composition is observable from primary disclosure or only from a gated TrendForce subscription. That gap is this brief.
- The anchor the row wants to extend does not exist.
anchors/hyperscaler-capex/was empty on 2026-07-15, empty on 2026-08-01, and I re-confirmed by directlson 2026-09-06: still empty./investing:edgar-watchis self-labelled "scaffold v0 (2026-05-17)" with "the implementation ... lands in a future build session." No pulse has ever been filed [[2026-07-15-capex-financing-layer-as-memory-cycle-phase-marker]], [[2026-08-01-hyperscaler-capex-merchant-vs-inhouse-silicon-decomposition]]. - The sibling question is already answered and is not this one. [[2026-07-15-capex-financing-layer-as-memory-cycle-phase-marker]] rejected hyperscaler financing as a phase marker and salvaged one thing: point the financing lens at the memory makers. That is FCF-vs-external-funding. This brief is capex composition. Adjacent, not duplicate — and the land-grab tell is explicitly the conjunction of the two: external funding rising while FCF deteriorates and composition shifts to greenfield wafers.
- The methodological template is already in the vault. [[2026-08-01-hyperscaler-capex-merchant-vs-inhouse-silicon-decomposition]] proved that hyperscaler capex cannot be split merchant-vs-in-house because "ASC 360 requires PP&E 'by major class'" and no finer. Same standard governs memory vendors — which turns out to cut the other way here, because for a memory maker the major classes are themselves the signal.
- The prior read on the physical clock. The ~$575B Korea greenfield announcement (Jul 2026) raised the Phase-3 prior without moving the clock — bit supply dated 2029-2030 [[2026-07-07-dram-hbm-phase2-phase3-early-signals]].
What the web says
- SK Hynix is now an SEC registrant — this is new and it changes build feasibility. SK hynix Inc. holds CIK 0002120882, ticker SKHY on Nasdaq: DRS confidentially submitted 2026-03-24, F-1 filed 2026-06-24, 8-A12B 2026-07-09, final prospectus 424B4 2026-07-10, and 19 Form 6-K filings since, most recent 2026-09-04 (SEC EDGAR submissions API, retrieved 2026-09-06). Samsung Electronics (CIK 0000879316) files only SC 13D/G, SUPPL and ARS — no 10-K, 10-Q, 20-F or 6-K, confirming it is not a periodic reporter (same source, same date).
- Micron discloses PP&E gross by asset class quarterly, and the classes are exhaustive. FY2025 10-K (filed 2025-10-03), $M, Aug-28-2025 vs Aug-29-2024: Land 420/284, Buildings 22,173/20,141, Equipment incl. not-placed-in-service 79,934/70,813, Construction in progress 5,518/3,444, Software 1,651/1,365, total 109,696/96,047. Components sum exactly to the total.
- The same table in the latest 10-Q shows the composition moving hard. Q3 FY2026 10-Q (period ended 2026-05-28, filed 2026-06-25), $M, vs FY2025 year-end: Land 420 (flat), Buildings 23,741, Equipment 88,113, Construction in progress 10,935 — up from 5,518, a near-doubling in nine months, Software 1,782, total 124,991. Micron's own footnote defines CIP as "Primarily includes building-related construction and tool installation."
- But the tools-ready gauge is flat. "Equipment not placed into service" went 4,050 → 4,200 over the same nine months (+3.7%), while cash capex over those nine months was $19,602M vs $10,199M in the prior-year nine months (+92%) and $15,857M for all of FY2025 (Micron XBRL companyconcept
PaymentsToAcquirePropertyPlantAndEquipment, retrieved 2026-09-06). Dollars are going into concrete; tools are not stacking up waiting for install. - Micron also discloses named-project attribution qualitatively. The Q3 FY2026 PP&E note discloses a $1,800M PP&E addition for the Tongluo, Miaoli County, Taiwan facility (Mar 2026). Management commentary attributes the FY2026 capex increase to "cleanroom facility-related capex — with the largest factor being Tongluo, followed by construction spend increase on U.S. fab projects," with FY2026 capex guided above $25B (up from ~$20B in Dec 2025), Idaho ID1 first wafer output pulled in to mid-CY2027, ID2 operational 2028, Singapore HBM advanced packaging contributing meaningfully in CY2027 (Micron FY2026 prepared remarks, via search summary; Digitimes, 2025-12-18). Attribution caveat: the primary PDFs on investors.micron.com 301-redirect and could not be fetched — see Sources.
- SK Hynix Q2 2026 (reported 2026-07-28): record results plus an explicit discipline pledge. Revenue KRW 79.3T (+51% QoQ, +257% YoY), operating profit KRW 60.5T, 76% operating margin; full-year capex guidance raised to the "high 40 trillion won range"; company language: it will "reinforce both its production capacity and financial health ... while maintaining capital expenditure discipline." NAND 321L targeted at 50% of domestic capacity by YE2026; HBM4 in mass production, HBM4E samples on 1cnm (SK hynix Newsroom, 2026-07-28; Investing.com Q2 2026 slides).
- The third-party WFE layer confirms migration-not-greenfield, but only in aggregate. SEMI's 300mm Fab Outlook press release (2026-06-29) projects 300mm memory fab equipment at $52B in 2026 (+29%) — DRAM $37B (+29%), 3D NAND $14B (+28%) — rising to $57B in 2027 and ~$80B by 2029 (19% CAGR 2024-29), with "effective capacity growth remains moderated by technology migration and process complexity." The report itself is a paid subscription; the free release carries no greenfield-vs-upgrade split (SEMI via PRNewswire, 2026-06-29). Lam guides 2026 WFE to the low-$150B range (up from a prior $140B); UBS models +20% to $136.5B with DRAM WFE up ~$13B, more than half the increase; Applied expects DRAM WFE to be double NAND medium-term; Lam DRAM was 23% of systems revenue in Q4 FY2026 vs 27% prior quarter (Zacks/Yahoo Finance, UBS via Tiger).
Convergences and contradictions
- Convergence — nobody discloses capex by purpose, and the reason is structural, not discretionary. No memory vendor publishes a greenfield / node-migration / HBM-packaging dollar split. This is the same GAAP disclosure floor [[2026-08-01-hyperscaler-capex-merchant-vs-inhouse-silicon-decomposition]] identified for hyperscalers: ASC 360 requires PP&E by major class, and "wafers for 1-gamma migration" is not a major class. Only a new rule or a voluntary change closes it, and the incentive runs the other way — capacity intent is the most competitively sensitive thing an oligopolist owns. Any brief claiming a purpose-split "from SEC filings" is using a vendor estimate or fabricating it.
- Contradiction the vault has not held before — the two Micron signals now point opposite ways. The shell/greenfield proxy (Land + Buildings + CIP as a share of the gross PP&E delta) went from 31.1% in FY2025 to 45.7% in the first nine months of FY2026 — and even stripping the entire $1.8B Tongluo acquisition out of the numerator, the floor is 38.4% (the ceiling, if none of Tongluo was shell, is 51.8%). CIP alone nearly doubled. That is composition rotating toward buildings — the early shape of the land grab. Simultaneously, equipment-not-placed-into-service rose only 3.7% while capex rose 92% YoY. Tools are not queued. Buildings first, tools later is exactly the 18-30 month signature of capacity that lands in 2027-2028, not 2026 — which corroborates rather than contradicts the vault's existing "greenfield bit supply dated 2027+" read [[2026-07-07-dram-hbm-phase2-phase3-early-signals]]. The composition needle has started to move; the capacity clock has not.
- Contradiction in kind — SK Hynix says "discipline" while raising capex guidance to the high-KRW-40T range and mass-producing HBM4. Stated discipline is cheap and is the standard oligopolist line at every cycle peak. It is commentary, not an observable, and it should carry no weight in a trigger set. The observable that would falsify it is the asset-class mix in the forthcoming 20-F, not the press release.
Synthesis for RDCO
The row's premise is right and its location is wrong, on two counts. First, anchors/hyperscaler-capex/ is an empty directory behind a v0 scaffold that has never run — bolting a feature onto it is building on sand, and it should not gate this work. Second and more important, the row conflates sides of the equation. Hyperscaler capex (GOOGL/AMZN/MSFT/META) is the demand anchor; memory-vendor capex composition is the supply anchor. Different companies, different filing systems, different signal polarity: hyperscaler capex falling is bearish for the thesis, vendor greenfield capex rising is bearish for the thesis. Merging them into one anchor would produce a series where two components move opposite directions for opposite reasons. The correct build is a new sibling anchor, anchors/memory-vendor-capex/, reusing the EDGAR plumbing that /investing:edgar-watch was specified for but has not yet implemented. Note the dependency honestly: this anchor needs the EDGAR client that the hyperscaler anchor also needs, so the first implementation session should build the shared client once and file both.
The purpose split the row asks for cannot be sourced, but a better-behaved proxy can, and it is machine-readable. Vendors will never publish "X dollars to greenfield wafers, Y to 1-gamma migration, Z to TSV." What they must publish is PP&E by asset class — and for a fab operator those classes map onto the question almost cleanly. Land, Buildings, and Construction-in-Progress are shell: you only spend there to house wafer capacity you do not yet have. Equipment is tools: node migration and HBM/TSV packaging are overwhelmingly equipment purchases dropped into cleanrooms that already exist. So shell_share = Δ(Land + Buildings + CIP) / Δ(total gross PP&E) is a defensible greenfield-intensity gauge, and equipment_not_placed_into_service is the separate, sharper, nearer-dated gauge of capacity about to switch on. Both are disclosed by Micron quarterly. State the proxy's two real weaknesses plainly: Micron's own footnote says CIP "primarily includes building-related construction and tool installation," so CIP is contaminated with equipment; and gross-PP&E deltas are net of retirements and include acquisitions (Tongluo, $1.8B), so they are not capex. Report the metric as a ratio band with the acquisition stripped, never as a dollar decomposition — the same discipline [[2026-08-01-hyperscaler-capex-merchant-vs-inhouse-silicon-decomposition]] imposed on the merchant-silicon stack.
Concretely, the anchor to build. Directory ~/rdco-vault/01-projects/investing/anchors/memory-vendor-capex/, one CSV row per vendor-quarter with columns: vendor, period_end, filing_form, filed_date, source_url, capex_cash, ppe_gross_total, ppe_land, ppe_buildings, ppe_equipment, ppe_equip_not_in_service, ppe_cip, ppe_software, acquisitions_in_ppe, shell_share_pct, shell_share_ex_acq_pct, equip_not_in_service_yoy_pct, guided_bit_supply_growth_pct, capex_per_bit_index, tier. Sourcing per vendor: Micron — 10-Q and 10-K, the PP&E note, which lives in the Financial Report R-files (FilingSummary.xml → the report named Property, Plant, and Equipment (Details)), not in data.sec.gov/api/xbrl/companyfacts, because that API drops dimensional facts and Micron has not tagged ConstructionInProgressGross undimensioned since ~2020 (verified this session: HTTP 404 on the companyconcept endpoint, while the R-file carries the full class table). This is the single most important implementation gotcha and it will silently produce nulls if missed. SK Hynix — CIK 0002120882, 6-K for quarterly results now, 20-F for FY2026 due ~April 2027; because it reports under IFRS, IAS 16.73(e) requires a full PP&E movement schedule showing additions by class rather than only period-end balances, which is strictly better data than Micron's — flag this as a build-time verification against the first 20-F, not as a verified fact. Samsung — not an SEC periodic reporter; requires Korea's DART (OpenDART API) for the quarterly business report, or the English DS-division IR deck, and should be tiered lower and populated last. Cadence: quarterly, run at +5 weeks after each vendor's quarter end for the 10-Q/6-K, with an annual re-key at the 10-K/20-F. Realistic lag is 4-8 weeks for the number, 8-13 weeks for the audited class detail.
Thresholds, and where the signal reads today. Anchor the trigger set on three fields, none of which fires alone. (1) shell_share above 45% on a TTM basis for two consecutive quarters, acquisitions stripped — baseline is Micron's FY2025 31.1%; nine-month FY2026 is 45.7% raw, 38.4-51.8% ex-Tongluo, so this is at the threshold and ambiguous, not through it. (2) equip_not_in_service up >50% YoY at any vendor — tools bought and crated are capacity roughly two-to-three quarters from producing bits; currently +3.7%, clearly not triggered, and this is the field that keeps the near-term read disciplined. (3) capex_per_bit_index — capex divided by management-guided industry bit-supply growth — falling for two quarters means dollars are buying wafers again; this is the metric that most directly operationalises the vault's "capex is rising but bit supply isn't" observation, and it needs a backfill before it has a usable baseline. Composite rule, consistent with the existing Markov spec: raise the Phase-3 prior on (1) alone; declare a composition trigger only on (1) AND (2), or on (3) falling AND (2). Applying that today: Phase 2 holds, and the composition indicator has produced its first genuine flicker — the earliest such flicker the vault has recorded on this indicator, and it is Micron-only, proxy-based, and one quarter old. It should raise the Phase-3 prior modestly and trigger nothing. For a position/capital-cycle horizon the actionable content is not a trade; it is that the indicator the June 28 brief called the disciplined-cycle-specific signal has finally become measurable from primary sources, and it has stopped reading flat.
Why this is in the vault
This closes open follow-up #2 of [[2026-06-28-chip-memory-cycle-phase2-phase3-indicators]] by answering the feasibility question that follow-up left implicit, and it converts indicator #2 of the memory-cycle Phase 2→3 trigger set from a qualitative TrendForce-dependent read into a specified, primary-sourced, buildable anchor with named XBRL/R-file access paths, a field list, a cadence, and numeric thresholds — so the next session implements rather than re-researches. It also corrects the destination: this is a new memory-vendor-capex supply-side anchor, not a field on the demand-side hyperscaler-capex anchor, which is still an empty directory behind an unimplemented v0 scaffold.
Open follow-ups
- Backfill
shell_sharefor Micron across the 2017-18 and 2021-22 cycles and check whether it actually led the ASP rollover, and by how many quarters. Until that lead-time is measured the 45% threshold is a guess anchored to a single fiscal year, and n=0 tested cycles is the same weakness [[2026-07-15-capex-financing-layer-as-memory-cycle-phase-marker]] flagged on the finance-dependence ratio. - Verify SK Hynix's first EDGAR-filed PP&E note against IAS 16.73(e) — does the 20-F (due ~April 2027) or an interim 6-K actually carry additions-by-class, and is it Inline-XBRL tagged in a way the R-file parser can reach? If yes, SK Hynix becomes the highest-quality vendor in the series, not the hardest.
- Establish whether Korea's OpenDART API exposes Samsung's PP&E class detail in structured form, at what lag, and in Korean only — and decide whether Samsung is worth the parser or should be carried as a commentary-only Tier C row.
- Build the
capex_per_bit_indexdenominator. Each vendor guides industry bit-supply growth on its call in different words and different units; determine whether a consistent quarterly series can be assembled from disclosures alone, or whether this field is unavoidably TrendForce-dependent and should be dropped. - Resolve whether Micron's CIP contamination can be unwound. Micron's footnote lumps building construction with tool installation. Is there any disclosure — capitalized interest, the assets-not-yet-in-service note, or segment detail — that separates them, or is the 45% threshold permanently a band rather than a number?
- Re-fetch the Micron FY2026 prepared remarks from a stable primary URL and replace the search-summary attribution for the "above $25B" FY2026 capex guidance and the "cleanroom facility-related capex / largest factor being Tongluo" quote. Both are load-bearing in the synthesis and are currently Tier B.
- Decide whether the shared EDGAR client gets built once for both anchors. This anchor and
hyperscaler-capexneed the same R-file parser; scoping them as one build session is probably cheaper than two, and would finally put a first file in the empty hyperscaler directory.
Related
- [[2026-06-28-chip-memory-cycle-phase2-phase3-indicators]] — the parent brief; owns the "watch composition, not level" doctrine and the follow-up this brief executes
- [[2026-07-15-capex-financing-layer-as-memory-cycle-phase-marker]] — the sibling supply-side question (FCF vs external funding); the land-grab tell is the conjunction of financing and composition
- [[2026-08-01-hyperscaler-capex-merchant-vs-inhouse-silicon-decomposition]] — the disclosure-floor method reused here, and the source of the "never quote a proxy as a decomposition" discipline
- [[2026-07-07-dram-hbm-phase2-phase3-early-signals]] — the current tripwire scoreboard this brief's indicator #2 feeds
- [[2026-07-21-memory-maker-fab-financing-supply-side]] — memory-maker financing read; names greenfield-wafer composition as half of the land-grab conjunction
- [[2026-05-18-memory-cycle-v1.1]] — the live thesis whose anchor set this extends
Sources
Vault
~/rdco-vault/06-reference/research/2026-06-28-chip-memory-cycle-phase2-phase3-indicators.md~/rdco-vault/06-reference/research/2026-07-15-capex-financing-layer-as-memory-cycle-phase-marker.md~/rdco-vault/06-reference/research/2026-08-01-hyperscaler-capex-merchant-vs-inhouse-silicon-decomposition.md~/rdco-vault/06-reference/research/2026-07-07-dram-hbm-phase2-phase3-early-signals.md~/rdco-vault/06-reference/research/2026-07-21-memory-maker-fab-financing-supply-side.md~/.claude/skills/investing-edgar-watch/SKILL.md— self-labelled "scaffold v0 (2026-05-17)"- Empty directory, re-confirmed 2026-09-06 (a finding, not a source):
~/rdco-vault/01-projects/investing/anchors/hyperscaler-capex/
Primary (Tier A — retrieved directly from SEC EDGAR, 2026-09-06)
- Micron 10-K FY2025, accession 0000723125-25-000028, filed 2025-10-03 — PP&E class table, R71.htm
- Micron 10-Q Q3 FY2026, accession 0000723125-26-000015, period 2026-05-28, filed 2026-06-25 — PP&E class table, R44.htm; Tongluo $1.8B PP&E addition
- Micron XBRL companyconcept
PaymentsToAcquirePropertyPlantAndEquipment, CIK 0000723125 — quarterly/annual cash capex - Micron XBRL companyconcept
ConstructionInProgressGross, CIK 0000723125 — HTTP 404 (the negative result that forces R-file parsing) - SEC submissions API, CIK 0002120882 (SK hynix Inc., SKHY/Nasdaq) — F-1 2026-06-24, 8-A12B 2026-07-09, 424B4 2026-07-10, 6-K series through 2026-09-04
- SEC submissions API, CIK 0000879316 (Samsung Electronics Co Ltd /FI) — no 10-K/10-Q/20-F/6-K on record
Web
- SEMI, 300mm memory equipment investment to surpass $50B in 2026 — PRNewswire, 2026-06-29. Underlying "300mm Fab Outlook" is a paid subscription — not purchased, not retried.
- SK hynix 2Q26 business results — SK hynix Newsroom, 2026-07-28
- SK hynix Q2 2026 slides — Investing.com, 2026-07-28
- Micron hikes FY26 capex to US$20b — Digitimes, 2025-12-18
- Micron earnings preview: capex and more — TrendForce, 2026-06-22
- Lam Research DRAM push / WFE guidance — Zacks via Yahoo Finance, 2026
- UBS DRAM WFE revision — Tiger, 2026
- TrendForce, 2025-11-13 (2026 DRAM capex ~$61.3B; per-vendor splits) — cited via [[2026-06-28-chip-memory-cycle-phase2-phase3-indicators]], not re-fetched this session.
Unreachable — flagged, not retried
investors.micron.com/static-files/631b1a32-...(Q3 FY2026 prepared remarks) and.../e089f8c0-...(Q2 FY2026 prepared remarks) — both HTTP 301 to the IR overview page. The "above $25B FY2026 capex" figure and the "cleanroom facility-related capex / largest factor being Tongluo" quote are therefore Tier B (search-summary attribution), not primary-verified. See open follow-up #6.